PIOTS: Packaged Integrated photonics- based RF/Optical hybrid Transceiver key-elements for Sensing and communication
- Project category Altri programmi Europei
- Lab/Research Area Telecommunications, Computer Engineering, and Photonics Institute (TeCIP) InReTe Laboratory
- Expected funding €722 000
- Costo complessivo €1 121 000
- Principal investigator Scuola Superiore Sant'Anna
- SSSA involvement Coordinatore
- Sponsor European Space Agency (ESA)
PIOTS aims to create and demonstrate (through test vehicles) an end-to-end packaging line that shall include packaging manufacturing processes, equipment and techniques required to manufacture products for the space sector.
The technologies developed and included in the line will cover integrated optoelectronic and photonic packaging.
The existing INPHOTEC terrestrial packaging line will be upgraded and an appropriate quality system will be implemented in agreement with ECSS and ESCC documents issued for the space sector.
The business will arise from the market: SME, large industries as well as research institutions looking for adequate packaging development and manufacturing in the space industry. We expect that business for the packaging line will arise from the growing requests of PIC (Photonic Integrated Circuits) for space applications, as it is widely expected for terrestrial applications.